Home Page> Industry Information> Latest Global Memory Market Update: DRAM, LPDDR5, And NAND Flash Hot-Selling Trends And Price Analysis
Form: Global memory supply-demand tightness and rising prices — memory chips become an industry focus. DRAM, NAND, and other product prices continue to rise amid supply-demand imbalance. 2026/3/18 Browse:989 Keywords: Memory chips DRAM LPDDR5 NAND Flash SSD eMMC data center AI computing notebook memory storage price storage supply chain high-performance memory
Recently, the global memory chip market has remained under tight supply conditions with rising prices. Driven by the explosive growth of artificial intelligence (AI) data centers, cloud expansion, servers, and high-performance computing demands, DRAM, NAND Flash, and other memory products are experiencing structural shortages, and inventory cycles have significantly shortened. Market pricing power has shifted toward suppliers. According to the latest industry analysis, traditional memory contract prices are expected to rise sharply in 2026, with DRAM contract prices showing substantial quarter-over-quarter growth and NAND Flash prices increasing significantly. Meanwhile, smartphones, laptops, and servers continue to place orders for high-performance LPDDR, DDR5, and enterprise-grade SSDs, maintaining a persistent supply-demand gap. This round of supply tightness not only affects the consumer electronics market but has also impacted automotive electronics and other industries, making chip supply and price fluctuations a key variable in the global electronics supply chain.
PN (Part Number): MT62F1G64D8CH‑031 WT:B
FBGA Code: D9ZNT
This LPDDR5 memory module is currently a high-demand, high-performance solution. Combined with industry supply-demand trends (AI, data centers, and high-end terminals), its shipment volume has steadily increased, making it popular among OEMs, ODMs, and distribution channels.
Key Specifications:
Component Density: 64 Gb
Speed: 3200 MHz
MT/s (Transfer Rate): 6400 MTPS
I/O Voltage: 0.5 V
Operating Temperature: ‑25℃ to +85℃
Bus Width: x64
CAS Latency: Programmable
Pin Count: 496‑ball
Component Configuration: 1G x64
Package Type: GREEN WFBGA
Package Dimensions (W × L × H): 14.00 × 12.40 × 0.77 mm
This part is ideal for high-performance mobile devices, AI terminals, server expansion, and high-bandwidth memory systems.
Shenzhen Kinnotek Technology Co., Ltd. is a professional supplier of leading global semiconductor brands, partnering with SK hynix, Samsung, KIOXIA, Intel, Micron, Kingston, AMD, NVIDIA, Realtek, and more. The company offers a full range of storage and logic products, including DRAM, LPDDR, NAND Flash, eMMC, eMCP, BGA chips, CPUs, GPUs, and server-grade chips. With major inventory centers in Hong Kong and Shenzhen, Kinnotek supports fast delivery and flexible supply, ensuring global customer demands are promptly met. The company serves consumer electronics, industrial control, data centers, and AI computing industries.
Kinnotek maintains high-turnover inventory across dual-warehouse locations, stocking mainstream memory products and high-demand parts, including but not limited to LPDDR5, DDR5, enterprise NAND Flash, and high-bandwidth memory chips. This enables rapid response to OEM and distributor procurement and delivery requirements.
| Product name | PN | Line card |
| Graphics Memory (GDDR) | H56C8H24AIR-S2C | SK hynix |
| Graphics Memory (GDDR) | EDW4032BABG-60-F | ELPIDA |
| Graphics Memory (GDDR) | K4G80325FB-HC25 | SAMSUNG |
| Graphics Memory (GDDR) | H5GC8H24AJR-R0C | SK hynix |
| Graphics Memory (GDDR) | K4G80325FB-HC28 | SAMSUNG |
| Graphics Memory (GDDR) | D9SXD | Micron |
| Graphics Memory (GDDR) | D9VVR | Micron |
| Graphics Memory (GDDR) | H5GC8H24AJR-R2C | SK hynix |
| Graphics Memory (GDDR) | D9TXS | Micron |
| Graphics Memory (GDDR) | D9VRK | Micron |
| Graphics Memory (GDDR) | D9WCW None8+ | Micron |
| Graphics Memory (GDDR) | D9WCR | Micron |
| Graphics Memory (GDDR) | K4Z80325BC-HC14 | SAMSUNG |
| Graphics Memory (GDDR) | K4Z80325BC-HC16 | SAMSUNG |
| Graphics Memory (GDDR) | H56C8H24AIR-S2C | SK hynix |
| Graphics Memory (GDDR) | H56G32CS4D-X005 | SK hynix |
| Graphics Memory (GDDR) | H56C8H24MJR-S0C | SK hynix |
| Graphics Memory (GDDR) | H56C8H24MJR-S2C | SK hynix |
| Graphics Memory (GDDR) | H56G42AS6D-X014 | SK hynix |
| Graphics Memory (GDDR) | H56G42AS8D-X014 | SK hynix |
| Graphics Memory (GDDR) | D9XKV | Micron |
| Graphics Memory (GDDR) | D9ZPL | Micron |
| Graphics Memory (GDDR) | D9ZPP | Micron |
| Graphics Memory (GDDR) | K4ZAF325BC-SC16 | SAMSUNG |
| Graphics Memory (GDDR) | K4ZAF325BC-SC20 | SAMSUNG |
| Graphics Memory (GDDR) | D8BWW | Micron |
| Graphics Memory (GDDR) | D8BGW | Micron |
| Graphics Memory (GDDR) | K4G41325FE-HC28 | SAMSUNG |
| Graphics Memory (GDDR) | K4ZAF325XM-SH12 | SAMSUNG |
| Graphics Memory (GDDR) | MT51J256M32HF-70:B | Micron |
| Graphics Memory (GDDR) | H56C8H24AIR-S2C | SK hynix |
| Graphics Memory (GDDR) | EDW4032BABG-60-F | ELPIDA |
| Graphics Memory (GDDR) | K4G80325FB-HC25 | SAMSUNG |
| Graphics Memory (GDDR) | H5GC8H24AJR-R0C | SK hynix |
| Graphics Memory (GDDR) | K4G41325FE-HC28 | SAMSUNG |
| Graphics Memory (GDDR) | MT51J256M32HF-70:B | Micron |
| GPU Chip | N17S-G1-A1 | NVIDIA |
| GPU Chip | N17S-G2-A1 | NVIDIA |
| GPU Chip | N17S-G5-A1 | NVIDIA |
| GPU Chip | N18S-G5-A1 | NVIDIA |
| eMMC Flash Memory | BWCTA1311X32G | BIWIN |
| eMMC Flash Memory | SDIN9DW4-32G | Sandisk |
| eMMC Flash Memory | SDIS6BM-128G | Sandisk |
| eMMC Flash Memory | H26M64003DQR | SK hynix |
| eMMC Flash Memory | H26M78003BFR | SK hynix |
| eMMC Flash Memory | 32G FBGA169 FW:0X82 | Micron |
| eMMC Flash Memory | 32G TFBGA153 FW1.2 | Micron |
| eMMC Flash Memory | 64G FBGA169 FW:0X82 | Micron |
| eMMC Flash Memory | SDINADF4-128G | Sandisk |
| eMMC Flash Memory | H26M74002HMR | SK hynix |
| eMMC Flash Memory | BWCTA1311X32G | BIWIN |
| eMMC Flash Memory | SDIN9DW4-32G | Sandisk |
| eMMC Flash Memory | SDIS6BM-128G | Sandisk |
| eMMC Flash Memory | H26M64003DQR | SK hynix |
| eMMC Flash Memory | H26M78003BFR | SK hynix |
| eMMC Flash Memory | 32G FBGA169 FW:0X82 | Micron |
| eMMC Flash Memory | 32G TFBGA153 FW1.2 | Micron |
| eMMC Flash Memory | 64G FBGA169 FW:0X82 | Micron |
| eMMC Flash Memory | SDINADF4-128G | Sandisk |
| eMMC Flash Memory | H26M74002HMR | SK hynix |
| CPU | Xeon D-2191 SR41R | Intel |
| CPU | Xeon D-2191A SRCVG | Intel |
| CPU | QPD8 | Intel |
| CPU | QMXS | Intel |
| CPU | QN5Z | Intel |
| CPU | QMC1 | Intel |
| CPU | QP38 | Intel |
| CPU | QMC0 | Intel |
| CPU | SR3ZW | Intel |
| CPU | SR2KN | Intel |
| CPU | SR29E | Intel |
| CPU | SR29H | Intel |
| CPU | SR2A7 | Intel |
| CPU | SR1DV | Intel |
| CPU | SR16Y | Intel |
| CPU | SR215 | Intel |
| CPU | QRCT | Intel |
| CPU | QSBM | Intel |
| CPU | SR2R9 | Intel |
| CPU | SR2R8 | Intel |
| CPU | SR2RB | Intel |
| CPU | QJTP | Intel |
| CPU | QWCC | Intel |
| CPU | SRLFV | Intel |
| CPU | SRLGH | Intel |
| CPU | SR1DC | Intel |
| CPU | SR2A7 | Intel |
| Communication IC | SAS3008-1 | LSI |
| Communication IC | SS26-0B0P-01 P-PEX89144B0-1 | Broadcom |
| Communication IC | SS26-0B0P-02 P-PEX89144B0-2 | Broadcom |
| Communication IC | SS26-0A0P-01 P-PEX89144A0-1 | Broadcom |
| Communication IC | SS23-0B0P-02 P-PEX89088B0-2 | Broadcom |
| Communication IC | SS23-0A0P-01 P-PEX89088A0-1 | Broadcom |
| Communication IC | SS24-0B0P-01 P-PEX89104B0-1 | Broadcom |
| Communication IC | SS24-0A0P-01 P-PEX89104A0-1 | Broadcom |
| Communication IC | SS24-0B00-02 PEX89104B0-2 | Broadcom |
| Communication IC | SS27-0A0P-02 P-PEX89024A0-2 | Broadcom |
| Communication IC | SS22-0A0P-01 P-PEX89072A0-1 | Broadcom |
| Communication IC | SS22-0B0P-01 P-PEX89072B0-1 | Broadcom |
| Communication IC | SS22-0B0P-02 P-PEX89072B0-2 | Broadcom |
| Communication IC | SS02-0B00-00 PEX88096B0 | Broadcom |
| Communication IC | 5M240ZT144C5N | Intel |
| Communication IC | SS02-0A0P-00 P-PEX88096A0 | Broadcom |
| Communication IC | EY82C621 SR3HL | Intel |
| Communication IC | EY82C621 SR3HL | Intel |
| Communication IC | EY82C621 SR3HL | Intel |
| Communication Chip IC | 5M240ZT144C5N | Intel |
| Communication Chip | EY82C621 SR3HL | Intel |
| Communication Chip | EY82C621 SR3HL | Intel |
| Communication Chip | EY82C621 SR3HL | Intel |
| Bridge IC | 218-0844023 | AMD |
| Bridge IC | 216-0889018 | AMD |
| Bridge IC | QHDX ES | Intel |
| Bridge IC | QHPT ES | Intel |
| Bridge IC | QHPU ES | Intel |
| Bridge IC | 218-0844023 | AMD |
| Bridge IC | 216-0889018 | AMD |
| Bridge IC | QHDX ES | Intel |
| Bridge IC | QHPT ES | Intel |
| Bridge IC | QHPU ES | Intel |
| Automotive MCU | SPC56EL60L5CBFQR | ST |
Global memory supply-demand tightness and rising prices — memory chips become an industry focus.
DRAM, NAND, and other product prices continue to rise amid supply-demand imbalance.
Global memory inventory tightness and production capacity dynamics affecting market prices.
Major memory manufacturers push long-term supply contracts to meet AI supercycle demand.
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